Wafers arriving from Probe either have the reject die marked with ink dots or, the come with a map of the defect locations. The first step in Assembly is to saw between each die in both directions and separate or "dice" out the good die.

Next, the good die are die bonded or attached onto the frame of a package. This attach may be with an epoxy adhesive or with a silicon-metal eutectic bond.

Then, each pad on the die is connected to a corresponding pin on the package frame via a thin gold or aluminum wire (approx. 0.001" diameter). There are new methods of interconnect evolving, such as flip-chip, but wire bond is still the dominant method and is likely to continue to be for many years.

Finally, the bonded die and frame are sealed - either by a molded plastic compound, or by the attachment of a sealed lid.

Depending on the package type, the pins or leads may have to be trimmed and formed to the desired shape for use in applications.

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