To add the next layer of interconnect, first it is necessary to mask and etch via holes. Those are then filled with a deposited metal such as tungsten or titanium-tungsten, often known as a "plug", which will provide the electrical connection down between two layers of aluminum.

With the plug in place, the next layer of aluminum can be deposited, masked and etched. This process can be repeated for up to 5 or 6 layers of interconnect for complex logic chips. Memory chips typically only have a couple of metal layers.

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