Semiconductor Manufacturing Tour

Table of Contents

The Chip-Making Process

Making the Wafer

The Mask-Making Process

Epitaxy

Photolithography Process

Oxidation & Exposure

Etch & Strip

Diffusion & Implant

Deposition

Oxidation

Interconnect - Vias

Interconnect - Metallization

Chemical Mechanical Planarization

Interconnect - Layers

Inspection & Measurement

Yield Impact.......

Test, Assembly & Packaging

Wafer Probe or Test

Memory Repair

Assembly & Packaging

Package Test

The Chip-Making Process

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Slide 10 of 22

Notes:

    We saw how an oxide was used as a masking barrier to create diffused areas in the silicon. Various types of oxides are used for other purposes, usually to electrically isolate electrical paths or transistors from one another. Oxides can be grown by oxidizing silicon, or may be deposited on top of any material.
    Deep Field Oxides are grown into the silicon after more lithographic masking to electrically isolate each transistor from its adjacent partners.
    Dielectric isolation oxides are deposited in layers to insulate the transistors from the interconnecting layers which will be built above.
    Passivation oxides are later deposited on top of completed wafers to protect the surface from damage as they are handled and packaged.

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