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Semiconductor Manufacturing Tour
Table of Contents
The Chip-Making Process
Making the Wafer
The Mask-Making Process
Epitaxy
Photolithography Process
Oxidation & Exposure
Etch & Strip
Diffusion & Implant
Deposition
Oxidation
Interconnect - Vias
Interconnect - Metallization
Chemical Mechanical Planarization
Interconnect - Layers
Inspection & Measurement
Yield Impact.......
Test, Assembly & Packaging
Wafer Probe or Test
Memory Repair
Assembly & Packaging
Package Test
The Chip-Making Process
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Slide 10 of 22
Notes:
We saw how an oxide was used as a masking barrier to create diffused areas in the silicon. Various types of oxides are used for other purposes, usually to electrically isolate electrical paths or transistors from one another. Oxides can be grown by oxidizing silicon, or may be deposited on top of any material.
Deep Field Oxides are grown into the silicon after more lithographic masking to electrically isolate each transistor from its adjacent partners.
Dielectric isolation oxides are deposited in layers to insulate the transistors from the interconnecting layers which will be built above.
Passivation oxides are later deposited on top of completed wafers to protect the surface from damage as they are handled and packaged.
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