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Semiconductor Manufacturing Tour
Table of Contents
The Chip-Making Process
Making the Wafer
The Mask-Making Process
Epitaxy
Photolithography Process
Oxidation & Exposure
Etch & Strip
Diffusion & Implant
Deposition
Oxidation
Interconnect - Vias
Interconnect - Metallization
Chemical Mechanical Planarization
Interconnect - Layers
Inspection & Measurement
Yield Impact.......
Test, Assembly & Packaging
Wafer Probe or Test
Memory Repair
Assembly & Packaging
Package Test
The Chip-Making Process
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Slide 5 of 22
Notes:
Photography is the best analogy to describe the photolithography process. The stepper is like a photographic enlarger where a light source projects an image through a lens system onto photographic paper.
In the semiconductor case, the "light bulb" used to be a mercury arc lamp, but for DUV lithography has been replaced by excimer laser light sources. The image comes from our reticle, and this is then projected through a very complex quartz glass lens system on to the wafer which has been coated (spun-on) with an ultra-thin layer of photoresist material. The reticle image is either printed 1:1 in size or reduced by 4:1 or 10:1, depending on the particular stepper. Clearly, for a 4:1 reduction, the features on the reticle need only be one-fourth of those required on the wafer. The exposure time is dependant on many variable including the sensitivity of the resist, lens aperture, etc.
The machine used to do all of this is called a "stepper" because it literally does one die or a few die at a time, then steps to the next die or set of die until it has exposed the entire wafer.
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